Teledyne DALSA、Teledyne e2v和Teledyne Lumenera，所有Teledyne 技术公司[NYSE: TDY] 将在12月4日至6日在日本横滨D厅举行的2019年国际成像技术与设备技术展览会(ITE)上以Teledyne Imaging的形式展出。参观D-01展位，现场展示他们最先进的视觉解决方案。

     业界首款Multifield™CMOS TDI相机，全新Linea HS一次扫描即可捕捉亮场、暗场和背光图像。这项突破性的技术满足了平板显示、半导体晶圆检测、生命科学和其他光匮乏的应用对触控时间和可检测性的关键要求。当与Teledyne的Xtium™2 CLHS高性能帧抓取器相结合时，这些模型实现了无与伦比的数据吞吐量。下一代CLHS光纤接口经过现场验证，可提供可靠和高吞吐量的数据传输。

     Teledyne e2v的Emerald™67M图像传感器实现超高分辨率的电子检查，高端监控和显微镜。它的方形，每边8k分辨率，使下一代显示器制造Gen 10.5 95%的图像区域利用率。

     Teledyne的第一个CXP相机，设计性能和建立在Genie Nano的证明，业界领先的声誉。分辨率从1600万到6700万像素，健壮的构建质量，广泛的操作温度，和一个无与伦比的功能集高价值Linea ML CMOS多线相机，单色，RGB三线和RGB+近红外。Linea ML和Teledyne的Xtium2帧抓取器都有光纤接口，用于高要求的高速检测。

     Teledyne Lumenera的新型嵌入式相机系列提供高性能USB3型号，从2百万到12百万像素，在板级和封装版本，专门为满足嵌入式视觉系统的要求-更小，更轻，更低的成本。

     Teledyne e2v的全新Bora™飞行时间CMOS图像传感器提供卓越的灵敏度和独特的片上门控全球快门，使门控时间高达42ns。凭借其量身定制的3D检测和距离测量，BORA支持最新的工业应用，包括视觉引导机器人、物流和监控。

     预览17um CALIBIR GXM640 VGA测热摄像机，具有简单的辐射测量能力，无与伦比的场景动态范围和先进的PTP网络-完全符合GigE 1.1)

     Xtium2 CXP帧抓取器系列- Xtium2系列的最新添加支持CoaXPress 2.0，并具有12.5 gb的图像采集速率。Xtium2-CXP板有4、2和1通道配置。

     Xitum2-CLHS PX8支持有源光缆(AOC)和最大输入线速率的数据转发。最新的Xtium2还提供实时分布式图像处理和多场输出，以单独的图像缓冲区准备处理。

     Z-Trak 3D扫描仪使用激光三角测量技术实现实时高度测量，并为汽车、电子和工厂自动化提供可靠的在线测量、检查、识别和指导。

    请于2019年12月4-6日在日本横滨PACIFICO D馆D-01展位参观Teledyne Imaging团队。

     关于Teledyne Imaging 的Vision Solutions

     Teledyne Imaging 是Teledyne 旗下的一批前沿公司。Teledyne Imaging在整个光谱和几十年的经验形成了一个无与伦比的专业集体。每个公司都提供一流的解决方案。它们结合并利用彼此的优势，提供世界上最深入、最广泛的成像和相关技术组合。从航空航天到工业检验，显微镜，光谱学，射线照相和放射治疗，地理空间测量，以及先进的MEMS和半导体解决方案，Teledyne Imaging 提供全球客户支持和技术专长，以处理最艰巨的任务。他们的工具、技术和愿景解决方案旨在为客户提供独特的竞争优势。

Teledyne DALSA, Teledyne e2v, and Teledyne Lumenera, all  Teledyne Technologies [NYSE: TDY] companies will exhibit as Teledyne Imaging at the International Technical Exhibition on Imaging Technology & Equipment (ITE) 2019, December 4-6, in PACIFICO Yokohama Hall D, Japan. Visit booth D-01 to see their most advanced vision solutions in live demos. 

• The industry’s first Multifield™ CMOS TDI camera, the new Linea HS captures brightfield, darkfield, and backlit images at once in a single scan. This breakthrough technology meets the critical requirements for tact time and detectability in flat panel display, semiconductor wafer inspection, life sciences, and other light starved applications. When combined with Teledyne’s Xtium™2 CLHS high-performance frame grabbers, these models achieve unmatched data throughput. The next generation CLHS fiber optic interface is field-proven and provides reliable and high throughput data transmission.

• Teledyne e2v’s Emerald™ 67M image sensor achieves ultra-high resolution for electronics inspection, high-end surveillance and microscopy. Its square shape, with 8k resolution per side, enables 95% utilisation of the image area for the next generation of display manufacturing, Gen 10.5.

• Teledyne’s first CXP camera, designed for performance and built on Genie Nano's proven, industry-leading reputation. Resolutions from 16 to 67 Mpixels, robust build quality, wide operating temperature, and an unmatched feature set

• High-value Linea ML CMOS multi-line camera, monochrome, RGB tri-linear and RGB+ NIR. Linea ML and Teledyne’s Xtium2 frame grabber each have fiber optic interfaces for demanding, high-speed inspections.

• Teledyne Lumenera’s new Embedded Camera series provides high performance USB3 models, from 2 to 12 Mpixels, in both board level and enclosed versions designed specifically to meet the requirements of embedded vision systems – smaller, lighter, lower cost.

• Teledyne e2v’s new Bora™ Time-of-Flight CMOS image sensor offers excellent sensitivity and unique on-chip gated global shutter, enabling gating times of up to 42ns. With its tailored 3D detection and distance measurement, BORA supports the newest industrial applications, including vision guided robotics, logistics and surveillance.

• Preview the 17um CALIBIR GXM640 VGA bolometer thermal camera with simple radiometric capabilities, unparalleled scene dynamic range and advanced PTP networking – fully GigE 1.1 compliant).

• Xtium2 CXP frame grabber series – newest addition to the Xtium2 series supports CoaXPress 2.0 and features image acquisition rates of 12.5Gbs. The Xtium2-CXP boards are available in 4, 2 and 1-channel configurations.

• The Xitum2-CLHS PX8 supports Active Optical Cable (AOC) and dataforwarding at maximum input line rates. The newest Xtium2 also delivers real-time distributed image processing, and multifield output to separate image buffers ready for processing.

• The Z-Trak 3D scanners deliver real-time height measurement using laser triangulation and robust In-line measurement, inspection, identification and guidance for automotive, electronics, and factory automation.

Please visit the Teledyne Imaging team in PACIFICO Yokohama Hall D, Japan, December 4-6, 2019 in Booth D-01.

Media Note: For interview requests, please email yuki.chan@teledyne.com or visit Booth D-01 during the show. For high resolution images, please visit our online media kit.

About Teledyne Imaging’s Vision Solutions
Teledyne Imaging is a group of leading-edge companies aligned under the Teledyne umbrella. Teledyne Imaging forms an unrivalled collective of expertise across the spectrum and decades of experience. Individually, each company offers best-in-class solutions. Together, they combine and leverage each other’s strengths to provide the deepest, widest imaging and related technology portfolio in the world. From aerospace through industrial inspection, microscopy, spectroscopy, radiography and radiotherapy, geospatial surveying, and advanced MEMS and semiconductor solutions, Teledyne Imaging offers world-wide customer support and the technical expertise to handle the toughest tasks. Their tools, technologies, and vision solutions are built to deliver to their customers a unique and competitive advantage.